Bonder apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

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Details

219 5621, 228179, B23K 3702

Patent

active

044756810

ABSTRACT:
A wire bonder apparatus for use in connecting a conductor wire to a conductive element on a work piece, such as a microelectronic chip or wafer. The bonder apparatus includes a work piece support station adapted to support a work piece observable through a microscope viewing arrangement, and a bonding head having a support arm on which is mounted a bonding tool and selectively movable wire clamping arms adapted to incrementally feed a bonding wire to the bonding tool. The support arm is caused to undergo a ramped movement so as to effect a predetermined progressively increasing contact force between the bonding tool and the work piece. In one embodiment, the clamping arms are adapted for cooperation with actuator means so as to effect incremental stepped arcuate movement of clamping fingers along the path traversed by the conductor wire whereby to lineraly advance the bonding wire when gripped by the clamping fingers. Bonding wire supply means are selectively operable so as to maintain a desired tension in the bonding wire.

REFERENCES:
patent: 3626590 (1971-12-01), Miller
patent: 3727822 (1973-04-01), Umbaugh
patent: 3775579 (1973-11-01), Burghart et al.
patent: 3822465 (1974-07-01), Frankort et al.
patent: 4069961 (1978-01-01), Nicklaus et al.
patent: 4205773 (1980-06-01), Nicklaus
patent: 4340166 (1982-07-01), Bilane et al.
patent: 4389951 (1983-06-01), von Hagen

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