Bonded wafer SAW filters and methods

Details Bonded wafer SAW filters and methods Bonded wafer SAW filters and methods

2009-03-05

2011-10-11

Summons, Barbara (Department: 2817)

Wave transmission lines and networks

Coupling networks

Electromechanical filter

C333S194000, C310S31300R

Reexamination Certificate

active

08035464

ABSTRACT:
Improved coupling coefficients and desirable filter characteristics are exhibited in a SAW filter including an electrode pattern deposited on a piezoelectric substrate bonded directly to an anti-reflective layer, wherein the anti-reflective layer is bonded to a carrier through an adhesive layer such that a preselected thickness of the anti-reflective layer is sufficient for enhancing an acoustic match between the piezoelectric substrate and the adhesive layer.

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