Bonded wafer assembly system and method

Details Bonded wafer assembly system and method Bonded wafer assembly system and method

2011-05-17

2011-05-17

Thomas, Tom (Department: 2893)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C257SE21214, C225S094000, C225S096000, C225S097000

Reexamination Certificate

active

07943489

ABSTRACT:
A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

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