Bonded type piezoelectric apparatus, method for manufacturing th

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

310364, 310346, H01L 4108

Patent

active

053250125

ABSTRACT:
The features of the present invention are 1) to apply metallization on the bonding surface of a piezoelectric ceramic with a metal likely to react with the piezoelectric ceramic material, 2) when the piezoelectric ceramic material is soldered on the bonding surface, to apply metallization with a metal likely to react with the solder material, 3) to provide between the metallizing layers formed in 1) and 2) a metallizing layer including metal which prevents reaction between the metals and their diffusion, 4) to use a mounting member for the piezoelectric ceramic which has substantially the same thermal expansion coefficient as the piezoelectric ceramic in non-polarization condition and 5) to solder in the non-polarization condition and thereafter to polarize. As the result, a bonded type piezoelectric apparatus with a high reliability or with a broad application temperature range near from the absolute zero temperature to the Curie point of the piezoelectric element, and a method of manufacturing the same are provided.

REFERENCES:
patent: 2430013 (1947-11-01), Hansell
patent: 3230503 (1966-01-01), Elliot et al.
patent: 3243792 (1966-03-01), Hamilton
patent: 3441754 (1969-04-01), Heny
patent: 3573511 (1971-04-01), Noren
patent: 3683211 (1972-08-01), Perlman et al.
patent: 3740822 (1973-06-01), Singleton
patent: 3891873 (1975-06-01), Yanagasawa et al.
patent: 4075364 (1978-02-01), Panzera
patent: 4109031 (1978-07-01), Marscher
patent: 4111572 (1978-09-01), Noone
patent: 4297607 (1981-10-01), Lynnworth et al.
patent: 4338300 (1982-07-01), Erickson et al.
patent: 4381469 (1983-04-01), Ogawa et al.
patent: 4433264 (1984-02-01), Nishiyama et al.
patent: 4445066 (1984-04-01), Nishiyama et al.
patent: 4468582 (1984-08-01), Fujiwara et al.
patent: 4490641 (1984-12-01), Takeuchi et al.
patent: 4551647 (1985-11-01), Day
patent: 4609427 (1986-09-01), Inamoto et al.
patent: 4769882 (1988-09-01), Rosen et al.
patent: 4804007 (1989-02-01), Bran
patent: 4825117 (1989-04-01), Thomas et al.
patent: 4890783 (1990-01-01), Li
patent: 5161728 (1992-11-01), Li

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonded type piezoelectric apparatus, method for manufacturing th does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonded type piezoelectric apparatus, method for manufacturing th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonded type piezoelectric apparatus, method for manufacturing th will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2379399

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.