Bonded three dimensional laminate structure

Details Bonded three dimensional laminate structure Bonded three dimensional laminate structure

2007-07-24

2007-07-24

Duverne, J. F. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S607560

Reexamination Certificate

active

10818038

ABSTRACT:
A conductive structure and method of manufacturing therefor includes a plurality of stacked metal laminates secured to one another via an intermetallic bond made from a metallic bonding agent.

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