Bonded structure with high-conductivity bonding element

Details Bonded structure with high-conductivity bonding element Bonded structure with high-conductivity bonding element

1997-12-12

2000-08-22

Raimund, Christopher

Fabric (woven, knitted, or nonwoven textile or cloth, etc.)

Scrim

Woven scrim

442 52, 4283128, B32B 1508

Patent

active

061072168

ABSTRACT:
A structure (20) is formed of a first article (22) such as a cold finger (82), a second article (24) such as an electronic component (78) to be affixed to and cooled by the cold finger (82), and a bonding element (26) disposed between and bonding together the first article (22) and the second article (24). The bonding element (26) includes a porous metallic body (28), such as a screen, a mesh, a felt, or a foam, and a mass of resin adhesive (36) impregnated into the metallic body (28). The mass of adhesive (36) contacts and bonds to the first article (22) and to the second article (24), and the porous metallic body (28) forms a substantially continuous, high-conductivity path between the first article (22) and the second article (24).

REFERENCES:
patent: 3839080 (1974-10-01), Jarema et al.
patent: 4403653 (1983-09-01), Davidson

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