Bonded structure using reacted borosilicate mixture

Details Bonded structure using reacted borosilicate mixture Bonded structure using reacted borosilicate mixture

2006-02-07

2006-02-07

Goins, Davetta W. (Department: 2632)

Communications: electrical

Miscellaneous

C257S467000, C257S470000, C257S634000, C257S783000, C257S794000, C257SE21122

Reexamination Certificate

active

06995691

ABSTRACT:
Environmental sensors and other bodies, together with associated lead wires, are mounted to a oxidizable substrate for high temperature applications by means of a reacted borosilicate mixture (RBM) that secures the body relative to the substrate via of an oxide interface formed between the RBM and substrate during a high temperature reaction process. An oxide interface is also formed with oxidizable bodies to provide further mounting strength. The RBM is a B2O3—SiO2mixture, with the B2O3portion a function of the reaction temperature and desired bonding strength and viscosity.

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