Bonded structure

Stock material or miscellaneous articles – Structurally defined web or sheet – Including variation in thickness

Reexamination Certificate

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Details

C428S172000, C428S451000, C428S515000, C428S516000, C428S517000

Reexamination Certificate

active

07897245

ABSTRACT:
A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.

REFERENCES:
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patent: 5576101 (1996-11-01), Saitoh et al.
patent: 2006/0127282 (2006-06-01), Yamashita et al.
patent: 2010/0123273 (2010-05-01), Yamashita
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patent: 3515784 (2004-01-01), None
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International Search Report, dated Oct. 3, 2006.
Database WPI Week 198939, “XP-002515348”, Thomson Scientific, London, GB 1989-282614.
European Search Report dated Mar. 9, 2009.

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