Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2009-05-21
2011-11-15
Le, Thao (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C257SE23145
Reexamination Certificate
active
08058142
ABSTRACT:
A bonded semiconductor structure static random access memory circuit includes a support substrate which carries a first horizontally oriented transistor, and an interconnect region which includes a conductive line. The memory circuit includes a donor substrate which includes a semiconductor layer stack coupled to a donor substrate body region through a detach region, wherein the semiconductor layer stack is coupled to the interconnect region through a bonding interface, and wherein the semiconductor layer stack includes a pn junction.
REFERENCES:
patent: 4704785 (1987-11-01), Curran
patent: 4732312 (1988-03-01), Kennedy et al.
patent: 4829018 (1989-05-01), Wahlstrom
patent: 4854986 (1989-08-01), Raby
patent: 4939568 (1990-07-01), Kato et al.
patent: 5047979 (1991-09-01), Leung
patent: 5087585 (1992-02-01), Hayashi
patent: 5093704 (1992-03-01), Saito et al.
patent: 5106775 (1992-04-01), Kaga et al.
patent: 5152857 (1992-10-01), Ito et al.
patent: 5250460 (1993-10-01), Yamagata et al.
patent: 5265047 (1993-11-01), Leung et al.
patent: 5266511 (1993-11-01), Takao
patent: 5277748 (1994-01-01), Sakaguchi et al.
patent: 5308782 (1994-05-01), Mazure et al.
patent: 5324980 (1994-06-01), Kusunoki
patent: 5355022 (1994-10-01), Sugahara et al.
patent: 5371037 (1994-12-01), Yonehara
patent: 5374564 (1994-12-01), Bruel
patent: 5374581 (1994-12-01), Ichikawa et al.
patent: 5554870 (1996-09-01), Fitch et al.
patent: 5563084 (1996-10-01), Ramm et al.
patent: 5617991 (1997-04-01), Pramanick et al.
patent: 5627106 (1997-05-01), Hsu
patent: 5670411 (1997-09-01), Yonehara et al.
patent: 5695557 (1997-12-01), Yamagata et al.
patent: 5737748 (1998-04-01), Shigeeda
patent: 5829026 (1998-10-01), Leung et al.
patent: 5835396 (1998-11-01), Zhang
patent: 5854123 (1998-12-01), Sato et al.
patent: 5882987 (1999-03-01), Srikrishnan
patent: 5892225 (1999-04-01), Okihara
patent: 5915167 (1999-06-01), Leedy
patent: 5937312 (1999-08-01), Iyer et al.
patent: 5977579 (1999-11-01), Noble
patent: 5980633 (1999-11-01), Yamagata et al.
patent: 5998808 (1999-12-01), Matsushita
patent: 6009496 (1999-12-01), Tsai
patent: 6057212 (2000-05-01), Chan et al.
patent: 6103597 (2000-08-01), Aspar et al.
patent: 6153495 (2000-11-01), Kub et al.
patent: 6222251 (2001-04-01), Holloway
patent: 6229161 (2001-05-01), Nemati et al.
patent: 6242324 (2001-06-01), Kub et al.
patent: 6259623 (2001-07-01), Takahashi
patent: 6331468 (2001-12-01), Aronowitz et al.
patent: 6380046 (2002-04-01), Yamazaki
patent: 6380099 (2002-04-01), Sakaguchi et al.
patent: 6417108 (2002-07-01), Akino et al.
patent: 6423614 (2002-07-01), Doyle
patent: 6531697 (2003-03-01), Nakamura et al.
patent: 6534382 (2003-03-01), Sakaguchi et al.
patent: 6535411 (2003-03-01), Jolin et al.
patent: 6555901 (2003-04-01), Yoshihara et al.
patent: 6600173 (2003-07-01), Tiwari
patent: 6621168 (2003-09-01), Sundahl et al.
patent: 6630713 (2003-10-01), Geusic
patent: 6635552 (2003-10-01), Gonzalez
patent: 6638834 (2003-10-01), Gonzalez
patent: 6653209 (2003-11-01), Yamagata
patent: 6661085 (2003-12-01), Kellar et al.
patent: 6677204 (2004-01-01), Cleeves et al.
patent: 6742067 (2004-05-01), Hsien
patent: 6751113 (2004-06-01), Bhakta et al.
patent: 6762076 (2004-07-01), Kim et al.
patent: 6774010 (2004-08-01), Chu et al.
patent: 6787920 (2004-09-01), Amir
patent: 6806171 (2004-10-01), Ulyashin et al.
patent: 6809009 (2004-10-01), Aspar et al.
patent: 6822233 (2004-11-01), Nakamura et al.
patent: 6844243 (2005-01-01), Gonzalez
patent: 6854067 (2005-02-01), Kutz et al.
patent: 6864534 (2005-03-01), Ipposhi et al.
patent: 6943067 (2005-09-01), Greenlaw
patent: 6943407 (2005-09-01), Ouyang et al.
patent: 6995430 (2006-02-01), Langdo et al.
patent: 7002152 (2006-02-01), Grunewald
patent: 7052941 (2006-05-01), Lee
patent: 7067396 (2006-06-01), Aspar et al.
patent: 7078739 (2006-07-01), Nemati et al.
patent: 7109092 (2006-09-01), Tong
patent: 7148119 (2006-12-01), Sakaguchi et al.
patent: RE39484 (2007-02-01), Bruel
patent: 7217636 (2007-05-01), Atanackovic
patent: 7245002 (2007-07-01), Akino et al.
patent: 7256104 (2007-08-01), Ito et al.
patent: 7338884 (2008-03-01), Shimoto et al.
patent: 7378702 (2008-05-01), Lee
patent: 7470142 (2008-12-01), Lee
patent: 7470598 (2008-12-01), Lee
patent: 7632738 (2009-12-01), Lee
patent: 7633162 (2009-12-01), Lee
patent: 7671371 (2010-03-01), Lee
patent: 7709932 (2010-05-01), Nemoto et al.
patent: 7718508 (2010-05-01), Lee
patent: 7799675 (2010-09-01), Lee
patent: 7800199 (2010-09-01), Oh et al.
patent: 7846814 (2010-12-01), Lee
patent: 7867822 (2011-01-01), Lee
patent: 7888764 (2011-02-01), Lee
patent: 2002/0024140 (2002-02-01), Nakajima et al.
patent: 2002/0025604 (2002-02-01), Tiwari
patent: 2002/0141233 (2002-10-01), Hosotani et al.
patent: 2003/0067043 (2003-04-01), Zhang
patent: 2003/0102079 (2003-06-01), Kalvesten et al.
patent: 2003/0113963 (2003-06-01), Wurzer
patent: 2003/0119279 (2003-06-01), Enquist
patent: 2003/0139011 (2003-07-01), Cleeves et al.
patent: 2003/0205480 (2003-11-01), Sakaguchi et al.
patent: 2003/0224582 (2003-12-01), Shimoda et al.
patent: 2004/0113207 (2004-06-01), Hsu et al.
patent: 2004/0131233 (2004-07-01), Comaniciu et al.
patent: 2004/0147077 (2004-07-01), Watanabe et al.
patent: 2004/0155301 (2004-08-01), Zhang
patent: 2004/0156233 (2004-08-01), Bhattacharyya
patent: 2004/0160849 (2004-08-01), Rinerson et al.
patent: 2004/0259312 (2004-12-01), Schlosser et al.
patent: 2005/0280154 (2005-12-01), Lee
patent: 2005/0280155 (2005-12-01), Lee
patent: 2005/0280156 (2005-12-01), Lee
patent: 2006/0121690 (2006-06-01), Pogge et al.
patent: 2006/0275962 (2006-12-01), Lee
patent: 2007/0072391 (2007-03-01), Pocas et al.
patent: 2007/0190746 (2007-08-01), Ito et al.
patent: 2007/0262457 (2007-11-01), Lin
patent: 2008/0032463 (2008-02-01), Lee
patent: 2008/0048327 (2008-02-01), Lee
patent: 2009/0267233 (2009-10-01), Lee
patent: 2010/0038743 (2010-02-01), Lee
patent: 2010/0133695 (2010-06-01), Lee
patent: 2010/0190334 (2010-07-01), Lee
patent: 2011/0001172 (2011-01-01), Lee
patent: 2011/0003438 (2011-01-01), Lee
patent: 2011/0053332 (2011-03-01), Lee
BeSang Inc.
Le Thao
Schmeiser Olsen & Watts LLP
LandOfFree
Bonded semiconductor structure and method of making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonded semiconductor structure and method of making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonded semiconductor structure and method of making the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4258377