Bonded pin extrusion die and method

Metal working – Method of mechanical manufacture – Utilizing transitory attached element or associated separate...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29469, 228160, 425463, 425464, B23P 1700

Patent

active

059640200

ABSTRACT:
A honeycomb extrusion die and a method of making the die are disclosed, the die being made by bonding a die discharge section formed as a separate pin array to a separate die body incorporating an array of feed channels, the pin array comprising a plurality of pins attached to and extending outwardly from a body-compatible pin support which is removed after bonding the pins to the body. The pins may be formed of hard wear materials, and may have any of a variety of cross-sectional shapes adapted to improve extrusion uniformity as well as to form honeycomb cells of a variety of different cross-sectional shapes.

REFERENCES:
patent: 3678570 (1972-07-01), Paulonis et al.
patent: 3790654 (1974-02-01), Bagley
patent: 3846197 (1974-11-01), Wiley
patent: 4041597 (1977-08-01), Folmar et al.
patent: 4354820 (1982-10-01), Yamamoto et al.
patent: 4486934 (1984-12-01), Reed
patent: 4640454 (1987-02-01), Yamamoto et al.
patent: 4653996 (1987-03-01), Ozaki et al.
patent: 4780075 (1988-10-01), Ozaki et al.
patent: 4820146 (1989-04-01), Inoue et al.
patent: 4830598 (1989-05-01), Inoue et al.
patent: 4875264 (1989-10-01), Inoue et al.
patent: 4984487 (1991-01-01), Beckmeyer
patent: 5702659 (1997-12-01), Kragle et al.
patent: 5761787 (1998-06-01), Kragle et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonded pin extrusion die and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonded pin extrusion die and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonded pin extrusion die and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-644103

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.