Bonded layer protection structure for wear resistant component

Cutlery – Blades – Razor blade

Reexamination Certificate

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Details

C030S350000, C030S357000

Reexamination Certificate

active

06817103

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a bonded layer protection structure for a wear resistant component. More specifically, the invention relates to a bonded layer protection structure, which can be put to sufficient practical use in place of conventional solder bonding by increasing resistances to water and chemicals of a portion bonded by an adhesive between a cutting portion as a wear resistant member and a base metal as a main body portion in a wear resistant component such as a cutting tool.
DESCRIPTION OF THE RELATED ART
For example as shown in
FIG. 11
, a knife-shaped cutting blade
10
used for a bookbinder or a paper machine tool is constructed by bonding a cutting portion
12
made of high-speed tool steel or the like to a base metal
14
made of common steel. In addition, a slide rail
16
for supporting a structure to be freely slid shown in
FIG. 12
, and a work rest
18
for supporting various works used for, for example a centerless grinding machine shown in
FIG. 13
both have structures, where highly wear resistant blades
20
made of sintered hard alloys or the like are bonded to rail-shaped members
22
. Generally, the cutting portion
12
and the blade
20
(referred to as “wear resistance member
24
”, hereinafter), and the base metal
14
and the rail-shaped member
22
(referred to as “main body portion
26
”, hereinafter) are soldered together by using silver solder, copper solder or the like. The above-described cutting blade
10
, the slide rail
26
and the work rest
18
are cutting tools or the like having high resistances to wear, which are constructed by bonding the wear resistant member
24
to the main body portion
26
of the base metal or the like, and these are generically referred to as “wear resistant component
28
” hereinafter.
The wear resistant component
28
such as a cutting tool or the like constructed by bonding the wear resistant member
24
such as the cutting portion to the main body portion
26
such as the base metal is heated to about 800° C. in soldering even when low-temperature silver solder is used. However, since the wear resistant member
24
as a material to be bonded and the main body portion
26
have intrinsic coefficients of thermal expansion, which are different from each other, heat distortion in an entire portion by the heating, cracks in the wear resistant member
24
and other problems inevitably occur. Thus, in the wear resistant component
28
, when the wear resistant member
24
is soldered to the main body portion
26
, it is necessary to suppress the occurrence of heat distortion as much as possible, and execute careful temperature control to prevent cracks. Accordingly, a worker needs long-time experience and skills.
Therefore, as shown in
FIG. 14
, for example, regarding the cutting tool
28
as the wear resistant component, an attempt has been made to bond the cutting portion
24
to the base metal
26
by an adhesive
30
and to put to practical use. In the case of this bonding by the adhesive, different from the case of the above-described soldering, heating exceeding 200° C. is not carried out, and the work is basically carried out in a range of a normal temperature to 200° C. or lower. Thus, no problems such as the above-described heat distortion or cracks occur. However, compared with the soldering, adhesive strength between the cutting portion
24
and the base metal
26
was not sufficient, this bonding by the adhesive has not yet been put to wide practical use. With recent improvements in adhesive, however, by selecting a type of adhesive, and securing a relatively large bonding area between the cutting portion
24
and the base metal
26
, it is now possible to bond the cutting portion
24
to the base metal
26
with sufficient strength.
However, even for the cutting tool
28
constructed by bonding the cutting portion
24
to the base metal
26
by the adhesive
30
, when the cutting portion
24
is worn with time because of use, the cutting portion
24
is removed from the cutting machine or the like each time, and subjected to repeated grinding. In this event, since a layer of the adhesive
30
is partially exposed in the bonded portion between the cutting portion
24
and the base metal
26
, the exposed portion of the adhesive
30
is eroded by a grinding solution used for grinding, and deterioration gradually progresses. That is, even in the case of the adhesive for strongly bonding metal materials, resistances to water and chemicals have not yet been satisfactory. Thus, in the bonded portion between the cutting portion
24
and the base metal
26
, where the adhesive
30
low in water and chemical resistances is exposed, as a result of being exposed to the grinding solution in grinding, peripheral adhesive strength is inevitably lowered. The adhesive has low reliability in terms of durability for long-time use, and thus the adhesive has not been put to practical use for bonding in the wear resistant component
28
such as the cutting tool having the wear resistant member
24
such as a cutting portion bonded to the main body portion
26
of the base metal or the like.
In addition, as described above, even if both members
24
and
26
can be bonded together by the adhesive
30
with strength necessary for the cutting tool
28
by securing a large bonding area between the cutting portion
24
and the base metal
26
, compared with the above-described soldering, the bonding strength is usually lower. Consequently, when the cutting portion
24
is worn by repeated grinding, it is extremely dangerous to replace a cutter by another with a wear situation about equal to that during the conventional soldering set as a reference. When the cutting portion
24
is bonded to the base metal
26
by the adhesive
30
, a large bonding area must be secured therefore. However, since the wear of the cutting portion
24
is always accompanied by wearing-out of the bonded portion, bonding strength of the adhesive is correspondingly lowered. Thus, in the case of the cutting tool
28
bonding the cutting portion
24
to the base metal
26
by the adhesive
30
, a target of one type or another must be provided to clearly show a limit of use with consideration given to safety of a certain level. However, no presentations have been made yet to realize such.
SUMMARY OF THE INVENTION
The present invention was made to suitably solve the foregoing problems inherent in the wear resistant component such as a cutting tool constructed by bonding the wear resistant member such as s cutting portion to the main body portion such as a base metal. An object of the invention is to provide a protection structure for a bonded layer, which can be put to sufficient practical use in place of conventional soldering by increasing resistances to water and chemicals of an exposed portion of adhesive in the bonded layer. Another object of the invention is to provide means for clearly showing a limit of use with time of a wear resistant member effectively in a wear resistant component such as a cutting tool constructed by bonding a wear resistant member such as a cutting portion to a main body such as a base metal by adhesive.
In order to solve the above-described problem, and achieve the original object, in accordance with an aspect of the present invention, there is provided a bonded layer protection structure of a wear resistant component, comprising: a wear resistant component such as a cutting tool constructed by banding a wear resistant member such as a cutting portion to a main body portion such as a base metal by an adhesive. In this vase, a necessity part of an adhesive layer exposed portion in a bonded portion between the wear resistant member and the main body portion is covered with a filler or a covering material. For the filler, an adhesive having a resistance to water and/or a resistance to chemicals, or a silicon-containing caulking material is suitably used. For the covering material, a coating material having a resistance to water and/or a resistance to chemicals, a coating film of metal foil or

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