Bonded joint analysis

Details Bonded joint analysis Bonded joint analysis

Filed on

1997-06-23

Date issued

1998-11-24

Examiner

Noori, Max H.

Patent Class

Measuring and testing

SubClass

Specimen stress or strain, or testing by stress or strain...

SubSubClass

By loading of specimen

Other Related Categories

73827, G01L 124

Type

Patent

Status

active

Patent number

058410341

Description

ABSTRACT:
The present invention relates to a method of testing and/or monitoring structural adhesively bonded joints by the introduction of transducers into the stress or strain field effected by the movement of said adhesively bonded joints under load, such that the load transfer characteristics between the bonded materials and the adhesive can be recorded thus allowing the quantification of the integrity of the adhesive bond lines in such joints. The method assesses the integrity of the bond by comparing the difference in maximum and minimum ratios and curve perameters relating to stress and strain with those of the "at assembly" values.

REFERENCES:
patent: 4461536 (1984-07-01), Shaw et al.
patent: 4789236 (1988-12-01), Hodor et al.
patent: 5250802 (1993-10-01), Runner
patent: 5265475 (1993-11-01), Messinger et al.
"The UltraSPARC Processor--Technology White Paper; The UltraSPARC Architecture," Nov. 14, 1995, Sun Microsystems, Inc., Palo Alto, CA.

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