Bonded grid-cathode electrode structure

Details Bonded grid-cathode electrode structure Bonded grid-cathode electrode structure

1981-10-01

1983-09-20

Brammer, Jack P.

Electric lamp and discharge devices

Electrode and shield structures

Cathodes containing and/or coated with electron emissive...

313447, 313299, 51 5A, 51310, 51311, 51312, 430313, 430317, 430318, 340319, 430323, 430401, 430275, 430276, 156640, 156644, 156645, 427264, 427272, 427348, H01J 114

Patent

active

044058780

ABSTRACT:
A variety of technologies have been applied in the development of a bonded rid cathode. Erosion lithography is used for making the fine-detail grid structure, combining air erosion and lithographic techniques. To obtain openings of the order of 0.001 inch (one mil) or smaller, a nozzle with a high aspect ratio exit opening is used, and the cathode grid structure is scanned. A photo resist in which the grid pattern is developed is used over the molybdenum or tungsten grid film. The metal film is removed from the grid openings by chemical etching. The photo resist over the metal grid is used as a composite mask for removing the BN insulation in the openings by erosion with Al.sub.2 O.sub.3 powder from the special nozzle on the air blast gun.

REFERENCES:
patent: 3297902 (1967-01-01), Beggs
patent: 3392052 (1968-07-01), Davis
patent: 3599031 (1971-08-01), Beggs
patent: 3638062 (1972-01-01), Beggs
patent: 3644260 (1972-09-01), Beggs
patent: 3735186 (1973-05-01), Klupfer
patent: 4058432 (1977-11-01), Woldan et al.

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