Bonded ceramic-metal composite substrate, circuit board construc

Details Bonded ceramic-metal composite substrate, circuit board construc Bonded ceramic-metal composite substrate, circuit board construc

1992-05-28

1994-11-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 174256, 156 87, 361748, 361760, 361807, 361809, H05K 118, H05K 702

Patent

active

053632788

ABSTRACT:
A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, characterized in that the Vickers hardness of the copper sheet lies in the range from 40 kg/mm.sup.2 to 100 kg/mm.sup.2.

REFERENCES:
patent: 3716759 (1973-02-01), Scace et al.
patent: 4409278 (1983-10-01), Jochym
patent: 4985097 (1991-01-01), Matsumura et al.

Affiliated with

Also associated with

Rating

Bonded ceramic-metal composite substrate, circuit board construc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonded ceramic-metal composite substrate, circuit board construc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonded ceramic-metal composite substrate, circuit board construc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1787626