Bonded ceramic-metal composite substrate, circuit board construc

Details Bonded ceramic-metal composite substrate, circuit board construc Bonded ceramic-metal composite substrate, circuit board construc

1989-03-16

1992-10-13

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

174255, 361417, 361419, H05K 702

Patent

active

051556650

ABSTRACT:
A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, characterized in that the Vickers hardness of the copper sheet lies in the range from 40 kg/mm.sup.2 to 100 kg/mm.sup.2.

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