Bonded ceramic metal composite substrate, circuit board construc

Details Bonded ceramic metal composite substrate, circuit board construc Bonded ceramic metal composite substrate, circuit board construc

1990-02-26

1991-01-29

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

228123, 228124, 228195, 29832, H05K 302, H05K 310

Patent

active

049876775

ABSTRACT:
A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, wherein the median surface roughness (R.sub.a) of the outer surface of the copper sheet is not greater than 3 .mu.m, and the maximum surface roughness (R.sub.max) of the outer surface of the copper sheet is not greater than 18 .mu.m. The invention improves the manufacturing reliability of various electronic devices such as semiconductor modules.

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patent: 4628598 (1986-12-01), Taylor
patent: 4767049 (1988-08-01), Butt et al.
patent: 4811893 (1989-03-01), Kanahara et al.
patent: 4814944 (1989-03-01), Sagawa et al.

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