Bonded ceramic metal composite substrate, circuit board construc

Details Bonded ceramic metal composite substrate, circuit board construc Bonded ceramic metal composite substrate, circuit board construc

1989-04-25

1990-09-25

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 174258, 174259, 428612, 428687, H05K 100

Patent

active

049595075

ABSTRACT:
A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, wherein the median surface roughness (R.sub.a) of the outer surface of the copper sheet is not greater than 3 .mu.m, and the maximum surface roughness (R.sub.max) of the outer surface of the copper sheet is not greater than 18 .mu.m. The invention improves the manufacturing reliability of various electronic devices such as semiconductor modules.

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patent: 4409278 (1983-10-01), Jochym
patent: 4472762 (1984-09-01), Spinelli et al.
patent: 4490457 (1984-12-01), Kardashian et al.
patent: 4542438 (1985-09-01), Yamamoto
patent: 4628598 (1986-12-01), Taylor
patent: 4767049 (1988-08-01), Butt et al.
patent: 4811893 (1989-03-01), Kanahara et al.
patent: 4814944 (1989-03-01), Sagawa

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