Heat exchange – With repair or assembly means – Guide
Patent
1998-08-05
1999-11-23
Leo, Leonard
Heat exchange
With repair or assembly means
Guide
165 803, 165185, 174 163, 257722, 361704, F28F 700
Patent
active
059882662
ABSTRACT:
A high performance, high pin fin density heat sink (10) has mating first and second opposing base members (22, 24) having first and second pin fins (18, 20) extending generally perpendicularly therefrom. The pin fins (18, 20) are generally cylindrical and each bonded into recesses (30,32) formed on the opposing base member (22, 24). The spaces between nearest adjacent first and second pin fins (18, 20) form narrow fluid passageways (12) having a gas inlet in (14) for communicating with a heat generating body and gas out let end (16).
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catalogue material--Augmented Surface Bonded Heat Sinks published by AAVID.TM. Thermal Technologies, Inc. (Mar. 1996).
Kerr Roger S.
Smith Dean L.
Sobresky Edmund J.
Bailey, Sr. Clyde E.
Eastman Kodak Company
Leo Leonard
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