Metal working – Method of mechanical manufacture – Electrical device making
Patent
1990-10-30
1992-09-01
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 156 89, H01K 310
Patent
active
051427753
ABSTRACT:
A method is disclosed for providing less critical alignment of vias and through holes and lower bonding stresses in the manufacture of high density circuit boards. In the invention, a via is drilled through a land which is in a plane separate from that of the signal plane.
REFERENCES:
patent: 3675318 (1972-07-01), Merkenschlager
patent: 3739469 (1973-06-01), Dougherty, Jr.
patent: 3895435 (1975-07-01), Turner et al.
patent: 4030190 (1977-06-01), Varker
patent: 4211603 (1980-07-01), Reed
patent: 4258468 (1981-03-01), Balde
patent: 4642160 (1987-02-01), Burgess
patent: 4854038 (1989-08-01), Wiley
patent: 4864722 (1989-09-01), Lazzarini
patent: 4868350 (1989-09-01), Hoffarth et al.
IBM Tech Discl Bull vol. 22 No. 12 May 1980 Plating Holes in Wired Circuit Boards by R. J. Redolphy et al pp. 5301-5302.
IBM Tech Discl Bull vol. 27 No. 5 Oct. 1984, Signal Core by Direct Circuit Deposition by L. N. Chellis et al pp. 2829-2830.
Arbes Carl J.
Goldman Richard M.
International Business Machines - Corporation
Olsen Judith D.
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