Bondable polyamide

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

Patent

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Details

4284735, 4284747, 4284769, 428421, 4284752, B32B 2700, B32B 902, B32B 2706

Patent

active

044618050

ABSTRACT:
Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamide-imide.

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