Bondable compliant pads for packaging of a semiconductor chip an

Details Bondable compliant pads for packaging of a semiconductor chip an Bondable compliant pads for packaging of a semiconductor chip an

1997-06-10

2000-02-29

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

438118, 438119, H01L 2144, H01L 2148, H01L 2150

Patent

active

060308567

ABSTRACT:
A method of making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts and disposing a resilient element having one or more intermediary layers capable of being wetted by an adhesive between the microelectronic elements. The resilient element includes fibrous material, a fibrous matrix and/or voids formed at the intermediary layers thereof. An adhesive is provided between the intermediary layers and the microelectronic elements. The adhesive is then cured while it remains in contact with the intermediary layers for bonding the resilient element and the microelectronic elements. The electrically conductive parts are then bonded together to form electrical interconnections. A microelectronic package comprising a resilient element including one or more intermediary layers capable of being wetted by an adhesive is also provided.

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