Bond signature analyzer

Details Bond signature analyzer Bond signature analyzer

1989-12-22

1991-03-12

Heinrich, Sam

Metal fusion bonding

Process

With condition responsive, program, or timing control

228103, 228 8, B23K 2010, H01L 21607

Patent

active

049986643

ABSTRACT:
A feedback signal of an ultrasonic generator (13) employed in a ball bonder (11) is sampled by an analog-to-digital converter (23) under control of a microprocessor (25) to provide a "bond signature" indicative of bond quality. The microprocessor (25) then compares the bond signature to limits representing a good quality bond to provide an indication of a good or failed bond. The indication may be visually provided by projecting the bond signature and limits on a display (27), as well as automatically provided by a programmed comparison.

REFERENCES:
patent: 3445750 (1969-05-01), Uthe
patent: 3636456 (1972-01-01), Wright
patent: 3693158 (1972-09-01), Uthe
patent: 3852999 (1974-12-01), Wright
patent: 3934108 (1976-01-01), Howard
patent: 4815001 (1989-03-01), Uthe et al.
patent: 4824005 (1989-04-01), Smith, Jr.
"Monitoring System Instantly Detects Wire Bonding Defects", article, 1986.
"Non-Destructive Monitoring of Ultarsonic Bond Quality", article by R. V. Winkle, pp. 83-86, 5-1982.

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