Bond programmable integrated circuit

Details Bond programmable integrated circuit Bond programmable integrated circuit

1991-06-10

1992-11-03

Fears, Terrell W.

Electricity: electrical systems and devices

Discharging or preventing accumulation of electric charge

Specific conduction means or dissipator

365 51, 365 63, G11C 1300

Patent

active

051611244

ABSTRACT:
The described embodiments of the present invention provide a circuit and method for programming the mode options of an integrated circuit. The embodiment described provides this function for a dynamic random access memory but is applicable to any integrated circuit. The integrated circuit includes programming bonding pads which are either connected to a selected reference potential or left unconnected. Circuitry on the integrated circuit determines whether the pad is connected to the reference potential or is unconnected, and provides logical signals on the integrated circuit which select the operational mode of the integrated circuit. An additional feature of the described embodiment is a continuous checking to determine if the appropriate connected or unconnected state is being detected. This feature provides stray fields and other erroneous signals from altering the mode operation of the integrated circuit.

REFERENCES:
patent: 3737879 (1973-06-01), Greene et al.
patent: 4789966 (1988-12-01), Ozaki
patent: 4808844 (1989-02-01), Ozaki et al.

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