Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2005-09-27
2008-09-30
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S746000
Reexamination Certificate
active
07429795
ABSTRACT:
Bond pad structures are presented. Some embodiments of the structure include a conductive conductor-insulator layer overlying a substrate. The conductive conductor-insulator layer includes a composite region having a conductor sub-region and insulator sub-region, which neighbor each other, and a single material region. The insulator is harder than the conductor.
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CN Office Action mailed Nov. 19, 2007.
Chen Chih-Chiang
Chiu Ming-Jer
Shen Chin-Chi
Su Wen-Tsai
Potter Roy K
Taiwan Semiconductor Manufacturing Co. Ltd.
Thomas Kayden Horstemeyer & Risley
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