Bond pad option for integrated circuits

Details Bond pad option for integrated circuits Bond pad option for integrated circuits

1997-06-03

1998-06-09

Whitehead, Carl W.

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

438129, H01C 2208

Patent

active

057632987

ABSTRACT:
An integrated circuit having a first and second bond pads, a latch circuit, and a voltage lead. Different configurations of the internal circuitry of the integrated circuit are selected by applying the voltage lead either to the first or second bond pads. This result is achieved because the latch circuit, coupled between the first and second bond pads, is capable of inverting the voltage response seen at the first bond pad.

REFERENCES:
patent: 4985641 (1991-01-01), Nagayama et al.
patent: 5285069 (1994-02-01), Kaibara et al.
patent: 5303180 (1994-04-01), McAdams

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