Bond for tacking an electronic part

Details Bond for tacking an electronic part Bond for tacking an electronic part

1995-05-30

1998-04-21

Lorin, Francis J.

Stock material or miscellaneous articles

Composite

Of metal

B23K 3536

Patent

active

057415978

ABSTRACT:
An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond--is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.

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patent: 5102030 (1992-04-01), Tamashima et al.
patent: 5254412 (1993-10-01), Fujimoto
patent: 5302456 (1994-04-01), Matsui

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