Bond finger on via substrate, process of making same,...

Details Bond finger on via substrate, process of making same,... Bond finger on via substrate, process of making same,...

2007-12-04

2007-12-04

Norris, Jeremy C (Department: 2841)

Metal working

Method of mechanical manufacture

Electrical device making

C029S847000, C029S852000

Reexamination Certificate

active

10612281

ABSTRACT:
A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package includes coupling the die to the wire-bond pad. A computing system includes the wire-bonding substrate.

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