Bond finger on via substrate, process of making same,...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S847000, C029S852000

Reexamination Certificate

active

10612281

ABSTRACT:
A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package includes coupling the die to the wire-bond pad. A computing system includes the wire-bonding substrate.

REFERENCES:
patent: 5936844 (1999-08-01), Walton
patent: 6084295 (2000-07-01), Horiuchi et al.
patent: 6252178 (2001-06-01), Hashemi
patent: 6365433 (2002-04-01), Hyoudo et al.
patent: 6489682 (2002-12-01), Yeh et al.
patent: 6784376 (2004-08-01), Huemoeller et al.
patent: 6812580 (2004-11-01), Wenzel et al.
patent: 2003/0147227 (2003-08-01), Egitto et al.
patent: 2004/0004278 (2004-01-01), Cheng et al.
patent: 2004/0124545 (2004-07-01), Wang

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bond finger on via substrate, process of making same,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bond finger on via substrate, process of making same,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bond finger on via substrate, process of making same,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3865268

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.