Bond connection for components

Details Bond connection for components Bond connection for components

1989-01-30

1990-08-14

Heinrich, Sam

Metal fusion bonding

Process

Using bond inhibiting separating material

228179, 2281802, 228203, B23K 120, H05K 334

Patent

active

049480308

ABSTRACT:
An electrical joint using spheroidal tipped leads improves the strength of a connection regardless of the material used to bond the connections. Axial leads of a component are formed into spheroids using an appropriate heat source to melt a small portion of the lead tip. Melting a portion of the lead alloys the lead with any non-wettable solder mask rendering a wettable spheroid. Surface tension in the molten metal forms the spheroid. The spheroid increases the area to which solder or other bonding agent adheres to. Solder mask remaining on the lead decreases solder wicking further up the lead. Reduced solder wicking retains the compliance of the lead. Controlled melting of the lead maintains planarity for multileaded components.

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