Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Reexamination Certificate
2007-04-11
2009-08-25
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
C228S004500
Reexamination Certificate
active
07578422
ABSTRACT:
A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.
REFERENCES:
patent: 4619397 (1986-10-01), Urban
patent: 4771930 (1988-09-01), Gillotti et al.
patent: 4976392 (1990-12-01), Smith et al.
patent: 5018658 (1991-05-01), Farassat
patent: 5148959 (1992-09-01), Cain et al.
patent: 5400503 (1995-03-01), Komoriya et al.
patent: 5445306 (1995-08-01), Huddleston
patent: 5452838 (1995-09-01), Farassat
patent: 5452841 (1995-09-01), Sibata et al.
patent: 5616520 (1997-04-01), Nishiuma et al.
patent: 5868300 (1999-02-01), Babayan
patent: 5894981 (1999-04-01), Kelly
patent: 5906706 (1999-05-01), Farassat
patent: 6155474 (2000-12-01), Orcutt
patent: 6173879 (2001-01-01), Chiba
patent: 6271601 (2001-08-01), Yamamoto et al.
patent: 6276588 (2001-08-01), Johnson
patent: 6311890 (2001-11-01), Chapman et al.
patent: 6439448 (2002-08-01), Ringler
patent: 6595400 (2003-07-01), Terakado et al.
patent: 6667625 (2003-12-01), Miller
patent: 6715659 (2004-04-01), Ball
patent: 6786392 (2004-09-01), Nogawa
patent: 6800555 (2004-10-01), Test et al.
patent: 6827248 (2004-12-01), Farassat
patent: 6845898 (2005-01-01), Ball et al.
patent: 7407079 (2008-08-01), Copperthite et al.
patent: 2004/0188499 (2004-09-01), Nosaka
patent: 2005/0223858 (2005-10-01), Lu et al.
patent: 2006/0016860 (2006-01-01), Kampschreur et al.
patent: 2177639 (1985-07-01), None
Kummerl Steven A.
Lange Bernhard P.
Brady III Wade J.
Stoner Kiley
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
LandOfFree
Bond capillary design for ribbon wire bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bond capillary design for ribbon wire bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bond capillary design for ribbon wire bonding will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4088331