Bond capillary design for ribbon wire bonding

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work

Reexamination Certificate

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C228S004500

Reexamination Certificate

active

07578422

ABSTRACT:
A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.

REFERENCES:
patent: 4619397 (1986-10-01), Urban
patent: 4771930 (1988-09-01), Gillotti et al.
patent: 4976392 (1990-12-01), Smith et al.
patent: 5018658 (1991-05-01), Farassat
patent: 5148959 (1992-09-01), Cain et al.
patent: 5400503 (1995-03-01), Komoriya et al.
patent: 5445306 (1995-08-01), Huddleston
patent: 5452838 (1995-09-01), Farassat
patent: 5452841 (1995-09-01), Sibata et al.
patent: 5616520 (1997-04-01), Nishiuma et al.
patent: 5868300 (1999-02-01), Babayan
patent: 5894981 (1999-04-01), Kelly
patent: 5906706 (1999-05-01), Farassat
patent: 6155474 (2000-12-01), Orcutt
patent: 6173879 (2001-01-01), Chiba
patent: 6271601 (2001-08-01), Yamamoto et al.
patent: 6276588 (2001-08-01), Johnson
patent: 6311890 (2001-11-01), Chapman et al.
patent: 6439448 (2002-08-01), Ringler
patent: 6595400 (2003-07-01), Terakado et al.
patent: 6667625 (2003-12-01), Miller
patent: 6715659 (2004-04-01), Ball
patent: 6786392 (2004-09-01), Nogawa
patent: 6800555 (2004-10-01), Test et al.
patent: 6827248 (2004-12-01), Farassat
patent: 6845898 (2005-01-01), Ball et al.
patent: 7407079 (2008-08-01), Copperthite et al.
patent: 2004/0188499 (2004-09-01), Nosaka
patent: 2005/0223858 (2005-10-01), Lu et al.
patent: 2006/0016860 (2006-01-01), Kampschreur et al.
patent: 2177639 (1985-07-01), None

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