Bond and method of making the same

Details Bond and method of making the same Bond and method of making the same

1978-11-14

1980-07-01

Dixon, Jr., William R.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

228122, 228124, 228208, 331 945D, 331 945P, 350288, 357 81, 428 36, 428630, 428642, 428656, 428666, 428672, 428686, H01S 300, G02B 512, H01L 2302, B23K 100

Patent

active

042103894

ABSTRACT:
A solid state laser rod and a mount through which heat is dissipated from the rod are joined together at a bond comprised of a reflective layer on the surface of the rod, a barrier layer over the reflective layer, and a solder layer between the barrier layer and the mount. The reflective layer may be applied by sputter or other deposition procedures and is highly reflective in the region of the spectrum at which the laser operates, thus insuring optimum efficiency for the rod. The barrier layer may be applied to the reflective layer by the same deposition procedure, and it is impervious to the solder so that the solder does not penetrate it and scavenge the reflective layer. The solder should have a low melting point so as to avoid setting up excessive mechanical stresses in the rod when the solder solidifies. Both the mount and the barrier layer may be covered with a wetting layer prior to soldering to achieve better adhesion of the solder.

REFERENCES:
patent: 3204157 (1965-08-01), Peterson
patent: 3391447 (1968-07-01), Ard
patent: 3711789 (1973-01-01), Dierschke
patent: 3873944 (1975-03-01), Vaguine et al.

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