Boltless carrier ring/carrier plate attachment assembly

Details Boltless carrier ring/carrier plate attachment assembly Boltless carrier ring/carrier plate attachment assembly

2005-03-15

2005-03-15

Wilson, Lee D (Department: 3723)

Abrading

Work holder

Lens or prism

C451S285000, C451S398000

Reexamination Certificate

active

06866571

ABSTRACT:
A polishing system is provided which includes an o-ring adapted to couple a carrier ring to a carrier plate. In some embodiments, one component may include a groove with which to receive the o-ring and the other component may be substantially absent of a groove adapted to receive an o-ring. Alternatively, both components may include a groove with which to receive the o-ring. Consequently, a semiconductor polishing system component comprising a notch adapted to receive an o-ring is also provided herein. In particular, the semiconductor polishing system component may be adapted to couple to another semiconductor polishing system component by use of the o-ring. In addition, a method for assembling a semiconductor polishing system is contemplated herein, which includes positioning a first component of the semiconductor polishing system against a portion of an o-ring protruding from a groove arranged within a second component of the semiconductor polishing system.

REFERENCES:
patent: 5449316 (1995-09-01), Strasbaugh
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5941758 (1999-08-01), Mack
patent: 5948204 (1999-09-01), Maveety et al.
patent: 5993302 (1999-11-01), Chen et al.
patent: 6024630 (2000-02-01), Shendon et al.
patent: 6068548 (2000-05-01), Vote et al.

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