Boil point prediction arrangement for cooking appliance

Details Boil point prediction arrangement for cooking appliance Boil point prediction arrangement for cooking appliance

1986-01-06

1987-05-12

Goldberg, E. A.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219494, 219449, H05B 102

Patent

active

046652922

ABSTRACT:
An automatic boil point prediction arrangement for a cooking appliance having an automatic surface unit, in which the surface unit is operated at a predetermined power level at least until the sensed utensil temperature rises to a predetermined threshold temperature. The heat up time required for the sensed utensil temperature to reach the threshold temperature is measured and an estimate of the additional completion time required for the water in the utensil to reach its boil point is established as a function of the heat-up time. A signal is generated upon expiration of this completion time to inform the user that boiling has begun.

REFERENCES:
patent: 3118044 (1964-01-01), Holtkamp
patent: 3153139 (1964-10-01), Sivacek
patent: 3384735 (1968-05-01), Linger
patent: 3819906 (1974-06-01), Gould, Jr.
patent: 4164645 (1979-08-01), Dogliotti
patent: 4214150 (1980-07-01), Cunningham
patent: 4241289 (1980-12-01), Bowling
patent: 4334145 (1982-06-01), Norris, Sr.
patent: 4351996 (1982-09-01), Kondo et al.
patent: 4379964 (1983-04-01), Kanazawa
patent: 4394565 (1983-07-01), Dills
patent: 4431906 (1984-02-01), Oota
patent: 4465228 (1984-08-01), Mori et al.
patent: 4492336 (1985-01-01), Takata et al.
patent: 4549527 (1985-10-01), Davis
Technical Paper--Presented to ASME by A. Myklebust et al--Aug. 1982--"Microcomputer Control of a Residential Range Top for Energy Conservation".
Technical Paper--International Appliance Technical Conf.--May 1983--Terai et al. "Boiling Point Detector for Surface Cooking Unit"--pp. 421-440.

Affiliated with

Also associated with

Rating

Boil point prediction arrangement for cooking appliance does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Boil point prediction arrangement for cooking appliance, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Boil point prediction arrangement for cooking appliance will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1804222