Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-20
1998-06-30
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
2 94, 224606, 224637, 224223, 224930, 361686, 361733, H05K 500, A45F 502, G06F 116
Patent
active
057743380
ABSTRACT:
A body integral electronics package housing is formed of cloth material that simulates a person's garment, such as a poncho or vest. The housing contains various pockets to confine various electronic modules, including a front pocket of such size as to overlie the breast and midriff portions of the person's torso. The front pocket confines a plurality of rigid electronic modules that are supported within the pocket in a row and column array. The user may twist or turn his torso and bend forward or back and the foregoing array, and the modules do not restrict that movement. Instead, the position of the individual modules independently adjusts to the torso's position.
REFERENCES:
patent: 417301 (1889-12-01), Weldon
patent: 4462525 (1984-07-01), Pingleton et al.
patent: 4589134 (1986-05-01), Waldron
patent: 4825471 (1989-05-01), Jennings
patent: 4876724 (1989-10-01), Suzuki
patent: 5148002 (1992-09-01), Kuo et al.
patent: 5211321 (1993-05-01), Rodriguez
patent: 5285398 (1994-02-01), Janik
patent: 5302806 (1994-04-01), Simmons et al.
patent: 5333768 (1994-08-01), Krentz
patent: 5416310 (1995-05-01), Little
patent: 5416730 (1995-05-01), Lookofsky
patent: 5488361 (1996-01-01), Perry
patent: 5491651 (1996-02-01), Janik
patent: 5494157 (1996-02-01), Golenz et al.
patent: 5533655 (1996-07-01), Duque
patent: 5553148 (1996-09-01), Werle
patent: 5555490 (1996-09-01), Carroll
patent: 5572401 (1996-11-01), Carroll
patent: 5581492 (1996-12-01), Janik
McDonnell Douglas Corporation
Sparks Donald
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