Body for keeping a wafer and wafer prober using the same

Details Body for keeping a wafer and wafer prober using the same Body for keeping a wafer and wafer prober using the same

2006-07-13

2008-09-16

Tang, Minh N (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S760020

Reexamination Certificate

active

07425838

ABSTRACT:
According to the invention, there is provided a wafer holding member for use in a wafer prober for inspecting a semiconductor wafer, including a chuck top and a supporting member for supporting the chuck top, wherein the supporting member has a bottom portion facing to the chuck top, a cavity portion is formed between the chuck top and the bottom portion of the supporting member, and there is provided, in the cavity portion, at least a portion of a cooling mechanism for cooling at least one of the chuck top and the supporting member. Further, there is provided a wafer prober using the wafer holding member.

REFERENCES:
patent: 5034688 (1991-07-01), Moulene et al.
patent: 6328096 (2001-12-01), Stone et al.
patent: 2003/0155939 (2003-08-01), Lutz et al.
patent: 2004/0046578 (2004-03-01), Uher et al.
patent: 2001-033484 (2001-02-01), None
patent: 2002-64133 (2002-02-01), None
patent: 2002-83667 (2002-03-01), None
patent: 2004-128509 (2004-04-01), None
patent: 2005-064313 (2005-03-01), None
Office Action dated Dec. 19, 2006.
Japanese Office Action, with English translation, Japanese Patent Application No. JP 2005-203749, mailed Jul. 25, 2007.

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