Board wiring pattern for a high density memory module

Details Board wiring pattern for a high density memory module Board wiring pattern for a high density memory module

1988-12-14

1991-04-30

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

H05K 702

Patent

active

050123890

ABSTRACT:
A high density memory module in which memory chips are mounted in an array of rows and columns on a printed circuit board. The circuit board includes groups of serpentine parallel conductors which extend along adjacent columns for connecting corresponding power, ground, control, address and data pins between the adjacent columns to one another. Adjacent groups of serpentine parallel conductors are nested within one another. According to the invention, high density packaging is provided for large chip arrays, using a minimum number to vias to interior board layers, and minimum interchip spacing.

REFERENCES:
patent: 4674812 (1987-06-01), Thom et al.
patent: 4689441 (1987-08-01), Dick et al.
patent: 4733461 (1988-03-01), Nakano
patent: 4734980 (1988-04-01), Nakamura et al.
patent: 4750076 (1988-06-01), Kammiller
Mitsubishi Circuit Board P4-60AC-AC-B (Photograph Front & Back-Side).
Mitsubishi VLSI MOS Memory RAM ROM New Package, Jan. 1988.
Mitsubishi LSIs M5M5256VP, RV-10L, -12L, -10LL, -12LL, Jan. 1988.
Mitsubishi Circuit Board P4-60AC-AC-B (Photograph, Front and Back Sides).

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