Board to board interconnect structure

Electricity: electrical systems and devices – Miscellaneous

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

339 17LM, 339176MP, 361414, H05K 114

Patent

active

044829370

ABSTRACT:
A board to board interconnect assembly is installed between a first multilayer circuit board and a second multilayer circuit board. The assembly is comprised of a first housing member carrying electrical contacts and a second housing member carrying electrical contacts which mateably engage with the contacts of the first housing member. The first and second circuit boards have corresponding arrays of plated through apertures selectively connected to the circuit layers of the respective boards. Socket carrying contacts are frictionally engaged in certain of the plated through conductive apertures of the first and second circuit boards to secure the first housing member to the first circuit board and the second housing member to the second circuit board. Flex contacts are installed in conductive plated through apertures of the boards opposite each of the socket contacts and are frictionally engaged with the socket contacts. The socket and flex contacts are frictionally coupled to electrically connect the circuit layers of the first circuit board with the circuit layers of the second circuit board in a direct vertical relationship. The opposed first and second housing members support and position the contacts and serve as spacers between the circuit boards.

REFERENCES:
patent: 2699534 (1955-01-01), Klostermann
patent: 3340439 (1967-09-01), Henschen et al.
patent: 3418533 (1968-12-01), Perotto
patent: 3459998 (1969-08-01), Focarile
patent: 3489954 (1970-01-01), Humphrey et al.
patent: 3591834 (1969-12-01), Kolias
patent: 3652899 (1972-03-01), Henschen
patent: 3836935 (1974-09-01), Johnson
patent: 3868162 (1975-02-01), Ammon
patent: 4133592 (1979-01-01), Cobaugh et al.
patent: 4232923 (1980-11-01), Otsuki et al.
patent: 4283755 (1981-11-01), Tracy
Ho et al., Multiple LSI Silicon Chip Modules with Power Buses Composed of Laminated Silicon Sheets with Metallized Upper and Lower Surfaces, IBM Tech. Disc. Bull., V. 22, #8A, Jan. 1980, pp. 3410 and 3411.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Board to board interconnect structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Board to board interconnect structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Board to board interconnect structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2363857

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.