Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-04-08
2000-05-02
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
060565578
ABSTRACT:
A board-to-board interconnect socket (40) provides electrical interconnection between printed circuit boards (50, 52). Resilient metalized particle interconnects (28) are disposed in holes in a rigid substrate (14) of desired thickness. Each resilient interconnect (28) includes first and second cap members (18, 20) that extend from opposing ends of the hole and beyond the respective surfaces of the substrate. The first and second cap members (18, 20) may be connected with a stem member (22) or conductive paste (34) that is disposed inside the hole. The hole may be lined with conductive material (26) such as conductive plating to facilitate conduction of electricity.
REFERENCES:
patent: 5306558 (1994-04-01), Takahashi et al.
patent: 5417577 (1995-05-01), Holliday et al.
patent: 5599193 (1997-02-01), Crotzer
TECKNIT, Conductive elastomeric connector, Jul. 1974.
Crotzer David R.
Delprete Stephen D.
Duverne J. F.
Nguyen Khiem
Thomas & Betts International Inc.
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