Board-to-board electronic interface using hemi-ellipsoidal...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07338292

ABSTRACT:
A board-to-board interconnect is presented. The interconnect is fashioned from solder beads or hemi-ellipsoidal surface features on a surface of a printed circuit board and contact pads on a second printed circuit board.

REFERENCES:
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 5122064 (1992-06-01), Zarreii
patent: 5432678 (1995-07-01), Russell et al.
patent: 5895281 (1999-04-01), Rothenberger
patent: 6447321 (2002-09-01), Perino et al.
patent: 6705877 (2004-03-01), Li et al.
patent: 6780028 (2004-08-01), Kennedy et al.
patent: 6846194 (2005-01-01), Self et al.
patent: 6896552 (2005-05-01), Kosmala
patent: 7097462 (2006-08-01), Ichikawa
patent: 2006/0202675 (2006-09-01), Parker et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Board-to-board electronic interface using hemi-ellipsoidal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Board-to-board electronic interface using hemi-ellipsoidal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Board-to-board electronic interface using hemi-ellipsoidal... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3976658

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.