Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-09-30
2003-07-15
Martin, David (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S803000, C361S792000, C361S751000, C361S736000, C361S743000, C361S749000, C361S777000, C361S784000
Reexamination Certificate
active
06594152
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to the field of packaging of electrical components. More particularly, the present invention relates to the field of electrically coupling printed circuit boards.
2. Description of Related Art
Mechanical connectors, such as friction-fit card edge connectors or pin-in-socket connectors for example, are typically used for electrically interconnecting printed circuit boards. Such connectors, however, are disadvantageous as each board must typically be configured with a respective correlating male or female connector. The ability to interconnect one board with another depends, then, on the type of connector on each board. Also, such connectors typically require some forced mechanical contact and are therefore inherently less reliable. To ensure proper alignment, each line or pin connection for such connectors typically requires a minimum width and spacing. Forced mechanical connections using long traces, dissimilar metals, and/or angular geometries, for example, also compromise the quality of the signal transferred and produce greater electromagnetic interference emissions. Typical mechanical connectors also consume relatively more space on printed circuit boards.
BRIEF SUMMARY OF THE INVENTION
A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive adhesive, a band comprising conductive film, a band comprising conductive tape, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.
REFERENCES:
patent: 4689721 (1987-08-01), Damerow et al.
patent: 5136122 (1992-08-01), Kwitkowski et al.
patent: 5170328 (1992-12-01), Kruppa
patent: 5521794 (1996-05-01), Hargrave et al.
patent: 5523695 (1996-06-01), Lin
patent: 5527998 (1996-06-01), Anderson et al.
patent: 5558522 (1996-09-01), Dent
patent: 5667388 (1997-09-01), Cottrell
patent: 5742484 (1998-04-01), Gillette et al.
patent: 5764497 (1998-06-01), Mizumo
patent: 5917149 (1999-06-01), Barcley et al.
patent: 6094359 (2000-07-01), Avramis et al.
Flip Chip On Printed Circuit Board (FCOB) With Anisotropic Conductive Film, J.H. Lau, Proceedings of the Technical Program NEPCON West, Abstract (1998).
Electrically Conductive Adhesives: An Assessment, K. Feldmann and R. Luchs, Surface Mount Technology, Abstract (May 1998).
Experimental Variables Effecting Chain Growth in Conductive Adhesives, R.E. Hefner and M.A. Palmer, Electronic Packaging Materials Science IX Symposium, Abstract (1997).
Ground And Power Planes For Impedance-Control And EMI Shielding In PCBs Made From Conductive TLPS Pastes, L. Brandt, S. Fu, P. Gandhi, and S.M. Wentworth, Proceedings of the Technical Conference IP Printed Circuits EXPO, Abstract (1997).
Potential Of Electrically Conductive Adhesives For MID-Technology, R. Luchs, MID '96 Molded Interconnect Devices 2nd International Congress, Abstract (1996).
Transient Liquid Phase Sintering Conductive Adhesives, C. Gallagher, G. Matijasevic, and M.A. Capote, SMI Surface Mount International Advanced Electronics Manufacturing Technologies Proceedings of the Technical Program, Abstract (1995).
Dealing With The Issues Of Lead Solder Replacements, J. Guy, Proceedings Of The Technical Program NEPCON West, Abstract (1995).
Z-Axis Conductive Adhesives As Solder Replacement, K. Chung, T. Devereaux, C. Monti, and M. Yan, 7th International SAMPE Electronics Conference: Critical Materials and Processes in a Changing World, Abstract (1994).
Organic Solders Take On New Shapes, K. Gilleo, 7th International SAMPE Electronics Conference: Critical Materials and Processes in a Changing World, Abstract (1994).
Electrical, Structural and Processing Properties of Electrically Conductive Adhesives, L. Li, C. Lizzul, H. Kim, I. Sacolick, and J.E. Morris, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Abstract (Dec. 1993).
Thermal Effects of Replacing Solder With Conductive Adhesives, O. Spalding, Hybrid Circuits, Abstract (May 1993).
Polymer Bonding Systems Offer Alternatives To Soldering, K. Gilleo, Electronic Packaging and Production, Abstract (Dec. 1992).
Z-Poxy As Solder Replacement For Surface Mounting Applications, K. Chung, R. Fleishma, D. Bendorovich, and Ya Min, ISHM '92 Proceedings Of the 1992 International Symposium on Microelectronics, Abstract (1992).
Polymer Thick Films: Materials and Applications, G. Castelli and G. Lovati, Proceedings of the 5th International Microelectronics Conference, Abstract (1988).
Low-Cost Direct Chip Attach: Comparison Of SMD Compatible FC Soldering With Anisotropically Conductive Adhesive FC Bonding, U. Behner, C.-P. Czaya, R. Haug, F.-D. Hauschild, H. Jiang, M. Kaloudis, S. Kotthaus, S. Kuschel, R. Schuetz, F. Schultze, C.P.O. Treutler, and W. Vogel, 2nd 1998 IEMT/IMC Symposium, Abstract (1998).
The Application Of Flip Chip Bonding Technology Using Anisotropic Conductive Film To The Mobile Communications Terminals, A. Torii, M. Takizawa, and M. Sawano, 2nd 1998 IEMT/IMC Symposium, Abstract (1998).
Polymeric Conductive Pastes As Solder Replacement For Flip-Chip Attachment, K.U. Maner, S.S. Ang, L.W. Schaper, and W.D. Brown, IEEE Transactions On Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, Abstract (Nov. 1998).
Reflowable Anisotropic Conductive Adhesives For Clipchip Packaging, T.Y. Sea, T.C. Tan, and E.K. Peh, Proceedings of the 1997 1st Electronic Packaging Technology Conference, Abstract (1997).
Low Cost Flip Chip Bumping Technologies, C.L. Wong, J. How, Proceedings of the 1997 1st Electronic Packaging Technology Conference, Abstract (1997).
Rheological Applications For Electronic Materials, J.F. Hyland, Proceedings of the Technical Program NEPCON West '98 Conference, Abstract (1998).
Flip Chip Bonding Primer, B. Potter, Circuits Assembly, Abstract (Sep. 1998).
Conductive Adhesive Bonding-In Surface Mount Technology, An Alternative to Soldering, F. Kriebel, VTE Aufbau—und Verbindungstechnik in der Elektronik, Abstract (Aug. 1998).
Flip Chips on PCBs With Anisotropic Conductive Film, J.H. Lau, Advanced Packaging, Abstract (Jul.-Aug. 1998).
Evaluation of Chip Scale Packaging Using Acoustic Micro Imaging: An Overview of Applications, Limitations And Directions For Future Developments, J.E. Semmens and L.W. Kessler, Pan Pacific Microelectronics Symposium: Proceedings of the Technical Program, Abstract (1998).
Fundamental Study On Adhesive Strength Of Electrical Conductive Adhesives, T. Inada and C.P. Wong, 4th International Symposium on Advanced Packaging Materials Processes, Properties, and Interfaces, Abstract (1998).
Surface Mount Conductive Adhesives With Superior Impact Resistance, S.A. Vons, Jr., Q.K. Tong, R. Kuder, and D. Shenfield, 4th International Symposium on Advanced Packaging Materials Processes, Properties, and Interfaces, Abstract (1998).
Alternate Safe Solvents In Hybrid Circuit Processing, A. Riso, Pan Pacific Microelectronics Symposium: Proceedings of the Technical Program, Abstract (1998).
Electrically Conductive Adhesives, J.E. Morris, Pan Pacific Microelectronics Symposium: Proceedings of the Technical Program, Abstract (1998).
Thick Film Conductors For 175 Degrees C Operation In Automotive Electronics, D. Nabatian, S. Shahbazi, O. Brown, and S. Schaller, 1997 International Symposium on Microelectronics, Abstract (1997).
Interconnect Resistance Characteristics Of Several Flip-Chip Bumping And Assembly Techniques, E. Nicewarner, 1997 International Symposium on Microelectronics, Abstract (1997).
The Characterization Of Enhanced, Reworkable, Thermoplastic Adhesives In Solder Replacement And Die Attach Applications, P.M
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Martin David
Tran Thanh Y.
LandOfFree
Board-to-board electrical coupling with conductive band does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Board-to-board electrical coupling with conductive band, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Board-to-board electrical coupling with conductive band will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3069053