Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2000-07-28
2002-01-15
Paumen, Gary (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S083000
Reexamination Certificate
active
06338630
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a board-to-board connector, and particularly to a board-to-board connector having an improved arrangement of contacts.
BACKGROUND OF THE INVENTION
Board-to-board connectors are commonly used in the computer field. Examples include U.S. Pat. Nos. 5,735,696 and 5,836,773. Referring to
FIG. 5
, a prior art board-to-board connector
14
shown in U.S. Pat. No. 5,836,773 comprises an insulative housing
16
and two rows of contacts
20
received in corresponding passageways
18
defined in the housing
16
for mating with a plug connector (not shown). Each contact
20
comprises an engaging apex
34
, a main body
26
and a tail section
24
extending from the main body
26
. The tail portions
24
of each row of the contacts
20
are arranged in a line for soldering to a printed circuit board (PCB) (not shown). With the development trend toward high density of elements in computers, the pitch between two adjacent contacts
20
is becoming shorter and shorter. Thus, a bridge phenomenon can form a short circuit between two adjacent solder portions
24
of the contacts
20
during soldering and adversely affects signal transmission of the connector
14
and the electrical devices connected thereto.
Hence, an improved board-to-board connector is required to overcome the disadvantages of the prior art.
BRIEF SUMMARY OF THE INVENTION
A main object of the present invention is to provide a board-to-board connector which provides a fine pitch contact arrangement while avoiding a bridge phenomenon between two adjacent contacts during both a normal soldering process and a solder repair process.
To fulfil the above-mentioned object, a board-to-board connector mounted on a PCB in accordance with the present invention comprises an insulative housing and a set of first and second contacts. The insulative housing comprises a central portion which defines two rows of passageways along opposite sides thereof for alternately receiving the first and second contacts. Two channels are communicatively positioned beside these two rows of passageways for receiving a plug connector. The first and second contacts have a similar structure except for solder portions thereof. The solder portion of the first contact is longer than that of the second contact and comprises a bridge portion and a solder section for soldering to a corresponding pad of a PCB. A notch is defined below the bridge portion. The solder portion of each second contact is located between and adjacent two bridge portions of neighboring contacts and forms a support post projecting upward. The top face of the solder section of each first contact and the top face of the support post of each second contact are adapted for contacting a heat source during a solder repair process, the former being located lower than the latter, thereby avoiding a bridge phenomenon with a short forming between adjacent contacts.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 5731958 (1998-03-01), Kozel
patent: 5735696 (1998-04-01), Nitsu et al.
patent: 6135785 (1998-04-01), Niitsu
patent: 5836773 (1998-11-01), McHugh et al.
patent: 5876217 (1999-03-01), Ito et al.
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Paumen Gary
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