Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-07-23
1999-11-16
Donovan, Lincoln
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
361803, H01R 909
Patent
active
059846925
ABSTRACT:
A board stacking connector chip, which is interposed between opposed first and second printed boards, for stacking both the printed boards, comprises an upper joint portion joined to a connection terminal of the first printed board, a pair of side portions which extend downward from terminal portions of the upper joint portion and are opposed to each other, and a pair of lower joint portions which extend by being bent inward transversely from the lower ends of side portions, being opposed to each other, and are joined to a connection terminal of the second printed board, the upper joint portion, paired side portions, and paired lower joint portions being formed into a substantially rectangular shape in section by bending a plate.
REFERENCES:
patent: 4647126 (1987-03-01), Sbota, Jr.
patent: 4673967 (1987-06-01), Hingrorany
patent: 4813129 (1989-03-01), Kanezos
patent: 5007872 (1991-04-01), Tang
Kumagai Yoshimitsu
Tanaka Ryoji
Donovan Lincoln
Duverne J. F.
Kyoshin Kogyo Co. Ltd.
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