Board on chip package and manufacturing method thereof

Details Board on chip package and manufacturing method thereof Board on chip package and manufacturing method thereof

2007-03-09

2009-06-23

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S124000

Reexamination Certificate

active

07550316

ABSTRACT:
An aspect of the present invention features a manufacturing method of a board on chip package. The method can comprise: (a) laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; (b) patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; (c) removing the dry film; (d) laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; (e) etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; (f) mounting a semiconductor chip on the solder ball pad by a flip chip bonding; (g) molding the semiconductor chip with a passivation material; (h) removing the carrier film and the thin metal film; and (i) laminating a lower photo solder resist under the solder ball pad. The board on chip package and the manufacturing method thereof according to the present invention can design a high density circuit since a circuit pattern is formed using a seed layer.

REFERENCES:
patent: 7081403 (2006-07-01), Kirloskar et al.
patent: 2008/0003716 (2008-01-01), Takahashi
patent: 2008/0009098 (2008-01-01), Lee et al.

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