Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-06-20
1999-12-21
Tolin, Gerald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361719, 363141, H05K 720
Patent
active
060057734
ABSTRACT:
A power supply module package suitable for both high packaged power density and cost effective manufacture. In an exemplary embodiment, the power supply module includes: (1) at least one printed circuit board containing conductors for interconnecting components of the power supply, (2) a thermally conductive baseplate or case operable for transferring heat generated inside the module to the outside environment, wherein the external package dimensions are of a sufficiently small size to allow the user the greatest flexibility in the design of the overall circuit assembly, (3) at least one power magnetic device operable for providing electrical isolation between the input and the output of the power module, and (4) a set of electrical leads to facilitate communication and power flow between the module and circuitry being powered. The present invention provides a highly compact, thermally conductive package for a power supply module (perhaps a DC/DC converter) that is cost effective, readily manufacturable, durable, and easily mounted to a circuit card, allowing the power module to, for example, form a portion of a distributed power architecture.
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Data Sheet, Vicor Corporation, Nov. 1996, "48V in /12V out/ 150W DC-DC Converter Module", pp. 1-12.
"A New Leadframeless IC Carrier Package Using Metal Base Substrate", ISHM '95 Proceedings, Tanaka, Nagamine, Koike, Takahashi, pp. 348-353.
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Rozman Allen Frank
Stevens David Leonard
Axenfeld Robert R.
Birnbaum Lester H.
Cox Craig J.
Lucent Technologies - Inc.
Tolin Gerald
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