Board Level Decapsulator

Details Board Level Decapsulator Board Level Decapsulator

1996-10-29

1999-08-03

Breneman, Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C23F 102

Patent

active

059320613

ABSTRACT:
A system that decapsulates an integrated circuit package while the package is mounted to a printed circuit board. The system includes a tray that supports a printed circuit board which has at least one integrated circuit package mounted to the board. Mounted to the tray is a clamp which clamps an injection head to the top of the package. The injection head is coupled to a source of decapsulation fluid which is sprayed onto the package. The decapsulation fluid is circulated across the package to remove the package material and expose the underlying integrated circuit. The injection head has a gasket that is pressed onto the package to prevent the fluid from leaking onto the printed circuit board. After the plastic is decapsulated the head can be removed from the package so that the integrated circuit can be tested while the circuit is connected to the printed circuit board.

REFERENCES:
patent: 4822441 (1989-04-01), Ohta et al.
patent: 4826556 (1989-05-01), Kobayashi
patent: 5252179 (1993-10-01), Ellerson et al.
patent: 5443675 (1995-08-01), Wensink
patent: 5489854 (1996-02-01), Buck et al.
patent: 5643835 (1997-07-01), Chia et al.
patent: 5783098 (1998-07-01), Martin et al.
patent: 5792305 (1998-08-01), Winsemius et al.

Affiliated with

Also associated with

Rating

Board Level Decapsulator does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Board Level Decapsulator, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Board Level Decapsulator will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-846353