Board inspecting apparatus, its parameter setting method and...

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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Reexamination Certificate

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07822261

ABSTRACT:
For each teaching image, a plurality of patterns of color pickup regions each include a first region for picking up a color of a first part and a second region for picking up a color of a second part are set, the color of each pixel in the first region and the color of each pixel in the second region are mapped as a target point and an exclusion point respectively, to a color space for each of the patterns of the color pickup regions, a degree in separation between a target point distribution and an exclusion point distribution in the color space is calculated for each of the patterns of the color pickup regions, a pattern of a color pickup region having a maximum degree in separation is selected, a color range which divides the color space and has the largest difference between the number of target points and the number of exclusion points in the selected pattern therein is found, and the found color range is set as a color condition used in a board inspecting process.

REFERENCES:
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patent: 6023663 (2000-02-01), Kim et al.
patent: 1 388 738 (2004-02-01), None
patent: 2-78937 (1990-03-01), None
patent: 09 089525 (1997-04-01), None
patent: 9-145633 (1997-06-01), None
Patent Abstracts of Japan; Publication No. 02-078937; Date of publication: Mar. 19, 1990 (2 pages).
Patent Abstracts of Japan; Publication No. 09-145633; Date of Publication: Jun. 6, 1997 (2 pages).
European Search report dated Oct. 12, 2007, issued in European Application No. 06115773.Jan. 2204, 7 pages.
Capson D W et al., “A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints” IEEE Transactions on Pattern Analysis and Machine Intelligene, vol. 10, No. 3, May 1988, 7 pages.
Patent Abstracts of Japan, Publication No. 09089525 dated Apr. 4, 1997, 1 page.

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