Board impedance management

Details Board impedance management Board impedance management

2005-08-30

2005-08-30

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C333S033000

Reexamination Certificate

active

06936773

ABSTRACT:
A system and method are disclosed in which separate impedance compensation circuitry is allocated for an interface according to the space occupied on a printed circuit board (PCB) by the interface. Where an interface occupies two or more layers of the PCB, an impedance compensation circuit is dedicated to each layer on behalf of the interface. By dedicating impedance compensation, not just to the interface alone, but to the physical space occupied by the interface, the system and method are able to exploit multiple-layer and same-layer trace impedances, save board space and/or provide AC timings recovery.

REFERENCES:
patent: 6219255 (2001-04-01), Teshome
patent: 6700457 (2004-03-01), McCall et al.
patent: 6782243 (2004-08-01), Shiotsu et al.
patent: 6822876 (2004-11-01), Goergen
patent: 2004/0228100 (2004-11-01), Wright

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