Board for printed wiring

Details Board for printed wiring Board for printed wiring

2005-07-05

2005-07-05

Lam, Cathy F. (Department: 1775)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C174S034000

Reexamination Certificate

active

06914183

ABSTRACT:
A board for printed wiring comprises an electromagnetic wave absorbing laminate (EM) provided on a surface of a substrate (1) with the intervention of an adhesive layer (2) of a metal oxide, the electromagnetic wave absorbing laminate (EM) comprising: (a) a magnetic layer (3) comprising a plurality of magnetic particles (31) having an average particle diameter of 1 to 150 nm and isolated from each other by an electrically insulative material (32); and (b) an electrically insulative layer (4), being alternately stacked in a multi-layer structure, the board for printed wiring has a reduced thickness and an improved electromagnetic wave absorbing characteristic in a high frequency band of not lower than gigahertz, as compared with a conventional one which has an electromagnetic wave absorbing layer of a composite material including fine magnetic particles simply dispersed in a resin binder.

REFERENCES:
patent: 5676812 (1997-10-01), Kadokura
patent: 5827445 (1998-10-01), Yoshida et al.
patent: 6048601 (2000-04-01), Yahagi et al.
patent: 6448491 (2002-09-01), Sato et al.
patent: 6625040 (2003-09-01), Tuttle
patent: 6713671 (2004-03-01), Wang et al.
patent: P2001-200305 (2001-07-01), None
patent: P2002-158484 (2002-05-01), None

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