Board for printed circuits and processes for manufacturing such

Details Board for printed circuits and processes for manufacturing such Board for printed circuits and processes for manufacturing such

1987-03-19

1988-08-23

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29846, 427 96, 427259, 427264, H05K 100, H05K 300

Patent

active

047662689

ABSTRACT:
A printed circuit board, in which the substrate (1) and interconnections (2) are masked by a solder-resistant lacquer mask consisting of two layers of lacquer (4,5), the lands (3) being left unmasked, one layer of lacquer (4), which extends to the edges of the lands (3) and directly masks the substrate (1), is provided at least in the region of the lands (3), and the other layer of lacquer (5) masks the interconnections (2), while leaving the lands (3) unmasked, and extends to the region occupied by the layer of lacquer (4) extending to the edges of the lands (3) the two layers overlapping.

REFERENCES:
patent: 4064287 (1977-12-01), Lipson et al.
patent: 4088828 (1978-05-01), Yamamoto et al.
patent: 4104111 (1978-08-01), Mack
patent: 4220810 (1980-09-01), Arai et al.
patent: 4390615 (1983-06-01), Courtney et al.
patent: 4413309 (1983-11-01), Takahashi et al.
patent: 4479983 (1984-10-01), Appelt et al.

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