Board for mounting semiconductor chip

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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4284111, 428457, 428901, 361774, 361777, 174268, B32B 1504, H01L 23498

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active

057442240

ABSTRACT:
A semiconductor chip mounting board includes a base material made of resin; a metallized pattern formed on a surface of the base material which defines a die-pad area on which a semiconductor chip is to be mounted; and the metallized pattern comprising a plurality of zigzag shaped pattern lines along imaginary straight line segments radially, outwardly extending from a central position of the die-pad area. The metallized pattern may be a plurality of zigzag shaped pattern portions along imaginary concentric circles having a center at a central position of the die-pad area. Otherwise, the metallized pattern may be a plurality of closed loop shaped frames which are overlapped on each other in a zigzag manner.

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Patent Abstracts of Japan, vol. 13, No. 486 (E-840), Nov. 6, 1989 & JP-A-01 194428 (Ibiden Co Ltd), Aug. 4, 1989.
Patent Abstracts of Japan, vol. 13, No. 493 (E-842), Nov. 8, 1989 & JP-A-01 198058 (Matsushita Electron Corp), Aug. 9, 1989.
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