Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1995-10-31
1998-04-28
Yamnitzky, Marie
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
4284111, 428457, 428901, 361774, 361777, 174268, B32B 1504, H01L 23498
Patent
active
057442240
ABSTRACT:
A semiconductor chip mounting board includes a base material made of resin; a metallized pattern formed on a surface of the base material which defines a die-pad area on which a semiconductor chip is to be mounted; and the metallized pattern comprising a plurality of zigzag shaped pattern lines along imaginary straight line segments radially, outwardly extending from a central position of the die-pad area. The metallized pattern may be a plurality of zigzag shaped pattern portions along imaginary concentric circles having a center at a central position of the die-pad area. Otherwise, the metallized pattern may be a plurality of closed loop shaped frames which are overlapped on each other in a zigzag manner.
REFERENCES:
patent: 3833838 (1974-09-01), Christiansen
patent: 4495377 (1985-01-01), Johnson et al.
patent: 5012389 (1991-04-01), Perry
patent: 5289346 (1994-02-01), Carey et al.
patent: 5348792 (1994-09-01), Hattori et al.
patent: 5365409 (1994-11-01), Kwon et al.
Patent Abstracts of Japan, vol. 7, No. 166 (E-188), Jul. 21, 1958 & JP-A-58 074059 (Tokyo Shibaura Denki KK), May 4, 1983.
Patent Abstracts of Japan, vol. 10, No. 340 (E-455), Nov. 18, 1986 & JP-A-61 144046 (Mitsubishi Electric Corp), Jul. 1, 1986.
Patent Abstracts of Japan, vol. 13, No. 486 (E-840), Nov. 6, 1989 & JP-A-01 194428 (Ibiden Co Ltd), Aug. 4, 1989.
Patent Abstracts of Japan, vol. 13, No. 493 (E-842), Nov. 8, 1989 & JP-A-01 198058 (Matsushita Electron Corp), Aug. 9, 1989.
Patent Abstracts of Japan, vol. 16, No. 403 (E-1254), Aug. 26, 1992 & JP-A-04 133454 (Ibiden Co Ltd), May 7, 1992.
Muramatsu Shigetsugu
Takeuchi Yukiharu
Shinko Electric Industries Co. Ltd.
Yamnitzky Marie
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