Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-11-21
2006-11-21
Wilczewski, Mary (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S127000, C438S464000
Reexamination Certificate
active
07138296
ABSTRACT:
A method of manufacturing a semiconductor device is described. A board that includes a flat back face, corresponding to a resin sealing area, and a front face that has projections is provided. The projections are formed of a metal that is integral with the board and include (a) a bonding pad provided in an area surrounded by an area that contacts an upper die, (b) a wiring that is integrated with the bonding pad and which extends to a semiconductor element mounting area, and (c) an electrode provided in one body with the wiring. A semiconductor element is mounted on the semiconductor element area and electrically connected to the bonding pad. The board is placed on a lower die and resin is filled into a space formed by the board and upper die. The board is divided into multiple devices such that the projections are separated by removing the board exposed at the back face of the resin.
REFERENCES:
patent: 5891758 (1999-04-01), Honda et al.
patent: 5969426 (1999-10-01), Baba et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6247229 (2001-06-01), Glenn
patent: 6462418 (2002-10-01), Sakamoto et al.
patent: 6554194 (2003-04-01), Sasaki et al.
patent: 6596564 (2003-07-01), Sakamoto et al.
patent: 6890835 (2005-05-01), Chu et al.
patent: 0751561 (1997-01-01), None
patent: 10313082 (1998-11-01), None
patent: 11163024 (1999-06-01), None
patent: 11195733 (1999-07-01), None
patent: WO 98/37742 (1998-08-01), None
CSP Technology, and mounting material and device supporting the technology-special issue of Denshi Zairyo.
Kobayashi Yoshiyuki
Maehara Eiju
Mashimo Shigeaki
Okawa Katsumi
Sakamoto Junji
Barnes Seth
Fish & Richardson P.C.
Sanyo Electric Co,. Ltd.
Wilczewski Mary
LandOfFree
Board for manufacturing a BGA and method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Board for manufacturing a BGA and method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Board for manufacturing a BGA and method of manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3675626